Technical Program

WA.L7: Stereoscopic, Multiview and 3D coding

Session Type: Lecture

Time: Wednesday, September 29, 10:15 - 13:25

Location: S425

Session Chairs: A. Murat Tekalp, Koc University and Chang-Su Kim, Korea University

Seok Lee; Samsung Electronics Co., Ltd.

HoCheon Wey; Samsung Electronics Co., Ltd.

Du-Sik Park; Samsung Electronics Co., Ltd.

Changyeong Kim; Samsung Electronics Co., Ltd.

M. Oguz Bici; Middle East Technical University

Gozde B. Akar; Middle East Technical University

Jae-Kyun Ahn; Korea University

Dae-Youn Lee; Korea University

Minsu Ahn; Samsung Advanced Institute of Technology

James Do Kyoon Kim; Samsung Advanced Institute of Technology

Changyeong Kim; Samsung Advanced Institute of Technology

Chang-Su Kim; Korea University

Break (30 minutes)

WA.L7.5: SPARSE DYADIC MODE FOR DEPTH MAP COMPRESSION

Shujie Liu; State University of New York at Buffalo

PoLin Lai; Technicolor Research & Innovation

Dong Tian; Technicolor Research & Innovation

Cristina Gomila; Technicolor Research & Innovation

Chang Wen Chen; State University of New York at Buffalo

Khaled Mamou; FittingBox

Christophe Dehais; FittingBox

Faten Chaieb; University of Manouba/ENSI

Faouzi Ghorbel; University of Manouba/ENSI

Gianluca Cernigliaro; Universidad Politécnica de Madrid

Fernando Jaureguizar Nuñez; Universidad Politécnica de Madrid

Julián Cabrera Quesada; Universidad Politécnica de Madrid

Narciso García; Universidad Politécnica de Madrid

Toshihiko Yamasaki; University of Tokyo

Kiyoharu Aizawa; University of Tokyo